What is the meaning and purpose of each layer of PADS

This article will explain in detail the significance and use of each layer of PADS. The content of the article is of high quality, so the editor will share it with you for reference. I hope you will have a certain understanding of the relevant knowledge after reading this article.

The use and function of each layer of PADS

TOP--- Top layer wiring and release element Devices

BOTTOM- underlying wiring and release element device

LAYER-3 to LAYER-120-ordinary layer can be wired, generally can not put components. If you bury the resistance, you can put some patches in it.

Solder mask top-Top solder resistance layer is copper exposed, used for welding, without green oil cover

Paste mask bottom-the bottom solder paste layer is used for steel mesh, which is a steel plate that makes holes where the patch components are to be exposed. When the copper mesh is covered on the PCB, the pads of the patch components are exposed. As soon as the solder paste is applied to the steel net, all the pads of the patch components on the PCB are coated with solder paste.

Top tin paste layer of paste mask top-

Drill drawing-borehole drilling

Silkscreen top-Top screen printing is printing characters, patterns, etc., on the surface of the circuit board.

Assembly drawing top-Top-level Assembly drawing

Solder mask bottom-bottom solder resistance layer

Silksceen bottom-bottom screen printing

Assembly drawing bottom-- bottom assembly drawing

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