Samsung and TSMC blame ARM design architecture for heating problems

For the past two years, Android's flagship smartphone has been trying to solve the fever problem. Qualcomm Snapdragon 888 has a serious fever problem. Although the recent Snapdragon 8 Gen 1 slightly solves this problem, the chip is still overheated. Samsung has been at the center of the fever problem, and many people think that Samsung's optimization is not good enough. However, according to a recent report from South Korea, Samsung's problem is the poor design of the ARM.

According to South Korean media Businesskorea, industry insiders point out that the AP processors of Qualcomm Snapdragon and Samsung Exynos are currently used in most Android flagship phones. However, these phones have problems in terms of heat, performance and power consumption. The design of AP processor is based on ARM architecture. Both Samsung Electronics and TSMC have confirmed the same problem. In addition, they claim that the causes of these problems are design rather than manufacturing.

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At the same time, professionals also pointed out that these problems are the result of a combination of manufacturing process, AP processor design, peripheral components and smartphone performance itself. IPhone's AP processor is also designed with ARM architecture, but iPhone has never experienced heat or performance problems.

There were earlier reports that Qualcomm would hand over production of Snapdragon 8 Gen 1 SoC to TSMC. However, problems such as power consumption and heating have not changed significantly.

ARM has transferred all its shares in its Chinese joint venture ARM China to SPV. This is a special purpose company under its parent company Softbank Corp. Group. Unlike other multinational companies, ARM China has been operating independently and has had a very unhappy relationship with ARM in the past two years.

Although ARM holds 47.33% of ARM China and is the largest shareholder, it has never been able to control ARM China.