Shulou(Shulou.com)11/24 Report--

On August 19, Dongxin said on the investor interactive platform that the company's 19nm advanced process NAND Flash products have completed the first round of taping and are currently in the process of product debugging.

Dongxin said that the company is constantly delving into updating the process, from 38nm and 24nm to the process of 19nm, which is now under development. By updating the process to bring customers more cost-effective, higher capacity products.

With regard to the research and development of 3D NAND chips, Dongxin revealed that the company is currently focusing on the research, design and sales of small and medium-sized general-purpose memory chips, and does not involve 3D NAND business for the time being.

In terms of vehicle specification-grade chips, Dongxin said that car-gauge-level memory products have higher requirements for product indicators, so product certification and introduction time is longer, and related products are currently in the process of active research and development and introduction.

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