Shulou(Shulou.com)11/24 Report--

Recently, according to the news of Kuiheng, it is reported that TSMC will recently evaluate the construction of a second wafer fab in the United States, which will be built in a 3-nanometer process, which will take about two years to build. In this regard, TSMC said on August 19 that it would not respond to market rumors.

Prior to this, TSMC's new 5nm plant in Arizona, USA, was launched at the end of July and is expected to produce in 2024, with a monthly production capacity of 20,000 tablets.

However, due to the vast land area of TSMC's Arizona plant, covering an area of about 445 hectares, it has been reported many times that TSMC will expand its Arizona investment plan to build six wafer plants.

Wei Zhe-Jia, president of TSMC, also said last year that TSMC has acquired a large area of land in Arizona to maintain flexibility, and further expansion is possible, but the first task is to make the first phase of the plant smoothly mass production. then the next step is decided on the basis of operational efficiency, cost-effectiveness, and customer needs.

It is understood that TSMC's 3nm process will still use the FinFET transistor structure, while Samsung's 3nm node will use the GAA transistor architecture. Samsung is even ahead of TSMC, turning 3nm technology to mass production.

Sources pointed out that AMD, Apple, Broadcom, Intel, MediaTek, Nvidia and Qualcomm have all placed orders for 3nm chips with TSMC, but Samsung's 3nm GAA process has not yet attracted orders from major chip suppliers.

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