Samsung Electronics: aims to more than triple chip foundry capacity by 2027

CTOnews.com, October 21, according to BusinessKorea, Samsung Electronics held the 2022 Samsung OEM Forum in Gangnam District, Seoul on October 20.

Jeong Ki-tae, vice president of the technology development department of the contract manufacturing department of the company, said that Samsung Electronics successfully mass-produced 3nm chips based on GAA technology for the first time in the world this year. Compared with 5nm chips, the power consumption of 3nm chips has been reduced by 45%, the performance has been improved by 23%, and the area has been reduced by 16%.

Samsung Electronics also plans to spare no effort to expand the production capacity of its chip foundry, with the goal of more than tripling its production capacity by 2027. To that end, the chipmaker is pursuing a "shell first" strategy of first building a clean room and then flexibly operating the facility when market demand arises.

"We are operating five factories in South Korea and the United States, and we have been given sites to build more than 10 factories," said Choi Si-young, president of Samsung Electronics' contract manufacturing business.

CTOnews.com learned that Samsung Electronics plans to launch a second-generation 3nm process in 2023, mass-produce 2nm in 2025 and 1.4nm in 2027, which Samsung first unveiled in San Francisco on October 3 (local time).