Samsung is developing a new automotive chip packaging technology: bonding lines with alumina coating

CTOnews.com, Nov. 10, according to TheElec, Samsung is working with its main partners to develop a new chip packaging technology for automotive chips.

According to sources, the tech giant is developing an alumina (Al2O3) coated bonding line technology that is more reliable and insulating than previous bonding lines.

CTOnews.com learned that bonding wires can connect I / O to a lead frame or printed circuit board.

In the past, most of them were made of gold (Au) because of their flexibility and electrical conductivity. But as gold prices continue to rise, many companies are trying to mix them with silver (Ag) or copper (Cu).

However, these mixed materials usually have weak adhesion with their coating materials. This is unacceptable for automotive chips because they are exposed to high temperatures and high humidity.

The aluminum alternatives Samsung is developing with Electron, NCD and LT Metals do not have these weaknesses.

Alumina is coated on the metal used as wires in nanoscale thickness.

Alumina has a good bond with the insulating coating material using epoxy resin. Precursors used to coat alumina, such as trimetallic aluminum, are also relatively cheap.

Samsung also plans to use atomic layer deposition to deposit alumina and is testing various thicknesses.

However, challenges remain, such as off-center balls. Traditionally, a ball is formed at the end of the bonding line connected to the electrode. The ball must be aimed at the center.