The appearance of vivo TWS 3 series headphones will be released on November 22.

CTOnews.com, November 14, vivo has announced that the vivo X90 series and vivo TWS 3 series headphones will be released on November 22.

Now, vivo has released the official rendering of the TWS 3 series headphones. According to reports, this will be vivo's first real Hi-Fi wireless headset in the world.

From the previous warm-up content, vivo TWS 3 series headphones more gimmicks, known as carrying a new generation of LE Audio Bluetooth audio technology, support Bluetooth 5.3, the industry's first full-link wireless true Hi-Fi, as well as intelligent ultra-wideband noise reduction, non-inductive body temperature monitoring, low delay in LC3 games, multi-device dual connection and so on.

According to the previous preheating, the vivo TWS 3 series headphones with the highest bit rate up to 1.2Mbps, equipped with high-performance DAC chips and ultra-wideband HD units above 40kHz, will be released this month.

CTOnews.com learned that the blogger @ digital chat station revealed that vivo TWS 3 will launch Qualcomm S5 QCC5171 chip + 12.2mm moving circle + independent DAC chip + DSP module in China. Adaptive EQ + UWB noise reduction is greatly improved compared with the previous generation, which we can look forward to.

"the new product launch of vivo X90 series and Hi-Fi wireless headphones will be held on November 22."

"vivo TWS 3 / Pro headset rendering will be exposed soon"