Vivo TWS 3 series true Hi-Fi wireless headset preheating: supports 360mm / m 176; surround space audio

CTOnews.com November 16 news, this afternoon, vivo officially announced that the vivo TWS 3 series of true Hi-Fi wireless headphones support 360 °surround space audio, declaring that "the original sound begins and the sound is there."

According to the official poster, the vivo TWS 3 series of headphones will be released on November 22. This also means that the vivo TWS 3 series headphones are expected to be unveiled at the vivo X90 series launch at 19:00 on November 22.

CTOnews.com learned that the headset is expected to carry a new generation of LE Audio Bluetooth audio technology, support Bluetooth 5.3, the industry's first full-link wireless true Hi-Fi, as well as intelligent ultra-wideband noise reduction, insensitive body temperature monitoring, low latency in LC3 games, and multi-device dual connections.

According to the digital blogger @ digital chat station, vivo TWS 3 will launch Qualcomm S5 QCC5171 chip + 12.2mm moving circle + independent DAC chip + DSP module in China. According to the previous information, the vivo TWS 3 series headphones have the highest bit rate up to 1.2Mbps, equipped with high-performance DAC chips and ultra-wideband HD units above 40kHz.