Shulou(Shulou.com)11/24 Report--

CTOnews.com reported on November 19, citing South Korean media Naver, that Samsung has worked with Silicon Frontline Technology of the United States to improve the yield of its semiconductor chips in the production process in order to catch up with TSMC in the 3-nanometer process.

According to the report, the yield of Samsung Electronics advanced process is very low, there has been a yield problem since the 5nm process, and the situation has become even worse in the 4nm and 3nm process. It is rumored that since mass production, the yield of Samsung's 3-nanometer solution has been no more than 20%, and the progress of mass production has fallen into a bottleneck.

Samsung currently has production-related problems on 4nm and 5nm process nodes, and the company does not want this problem to happen again on 3nm processes. Therefore, we hope to cooperate with Silicon Frontline Technology to help Samsung fab to improve the front-end (front-end) process and chip performance.

CTOnews.com learned that the American company provides chip identification evaluation and ESD (electrostatic discharge) prevention technology. ESD is one of the main causes of semiconductor chip defects, which is caused by the friction between equipment and metal in the manufacturing process. It is reported that Samsung has worked with Silicon Frontline for a long time in chip design and production, and achieved satisfactory results. The company will now use its technology in the chip verification process.

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