BYD Semiconductor launches PIM Module with Integrated current Detection

CTOnews.com, November 25, PIM products, as an important part of the IGBT product category, are integrated power devices suitable for industrial frequency conversion and servo drive fields. At this stage, in many IGBT module application scenarios, customers will carry out targeted current detection design around the module when designing the circuit, and carry out overcurrent protection while monitoring the working status of the module. BYD semiconductors introduce PIM power modules with integrated current detection functions.

Main specification

The NO.1 is packaged by BYD miniPACK2 and genePACK3, the specification range can cover 1200V 50A-150A, and the main topology is a three-phase full bridge.

The NO.2 is packaged by BYD miniPIM2 and genePIM3, the specification range can cover 1200V 50A-150A, and the main topology is rectifier + braking + three-phase full bridge.

* Note 1: the shape of the module package is for reference only, and the actual pin distribution shall be based on the sample.

* Note 2: the relevant design has been patented

Introduction of product characteristics

CTOnews.com learned that BYD IGBT4.0 chip is compatible with the mainstream package size of the market, uses independent sampling signal pins, optimizes DBC layout design, reduces sampling signal interference, high integration, simplifies driver design, expandable packaging and topology forms, can be customized according to customer requirements, and can be used in industrial frequency conversion and servo drive fields.

BYD semiconductor industry PIM module has a rich package series and a variety of customized topologies, and the products have been widely used in white goods, industrial frequency conversion, servo drive, commercial air conditioning and other fields.