TSMC 3nm process will be mass produced next week.

CTOnews.com, December 25, according to the Taiwan Economic Daily, Wei Zhe-Jia, president of TSMC, had predicted that the promise of "3nm mass production in Taiwan within this year" would be fulfilled. On December 23, TSMC issued an invitation to hold a 3nm mass production and plant expansion ceremony in Nanke next week (December 29).

CTOnews.com learned that Wei Zhe Jia mentioned at the French conference in October this year that the 3nm progress was in line with expectations, had a good yield and would be mass produced in the fourth quarter, and that customer demand for 3nm exceeded production capacity driven by high-speed computing and smartphone applications.

Earlier, Wei Zhe Jia explained at the technology forum that TSMC's 3nm "has unspeakable difficulties", but it is about to mass produce and maintain the fin field effect transistor (FinFET) architecture, mainly because the process technology is "not only good-looking, but also practical."

TSMC has repeatedly predicted a mass production of 3 nanometers in Nanke this year. Nanke Wafer 18 Plant is the main production base of 3-nm process. 3-nm process technology will be another whole-generation process after 5-nm (N5) process technology. 3-nm family contains multiple combinations, and 3-nm mass production this year. N3E is planned for mass production in the second half of next year, and N3P has been planned the year after next.