Wang Hong Electronics has mass produced 96 layers of 3D NAND Flash,2023 and completed 192 layers of product development at the end of the year.

Thanks to CTOnews.com netizen OC_Formula for clue delivery! CTOnews.com January 22 news, Wanghong Electronics Co., Ltd. is a non-volatile memory integrated component solution manufacturer, its headquarters is located in China Taiwan Hsinchu Science Park, its products are mainly ROM, NOR Flash and NAND Flash, mostly in the leading position.

Wang Hong currently owns a 12-inch fab and an 8-inch fab; the 6-inch fab was sold to Hon Hai in August 2021 for NT$2.52 billion.

Recently, Wanghong has made new progress in the development of 3D NAND flash memory products, and its 96-layer 3D NAND flash memory developed internally has begun mass production, marking a milestone in the NAND business of the chip manufacturer.

In addition, Wanghong previously stated that it expects to further complete the development of 192-layer 3D NAND Flash products by the end of 2023. CTOnews.com query found that Wanghong 48-layer 3D NAND Flash products were mass-produced in September 2021.

In response to the needs of 3D NAND Flash R & D and operation, Wanghong's board of directors approved a capital budget of NT $2.648 billion in December last year, including capital expenditure and 3D NAND Flash R & D machinery and equipment in 2023. It is expected to invest six times from the first quarter of 2023.

At the same time, Wanghong continues to promote serial flash memory technology, and began mass production of 45 nm 3V serial flash memory series products in January this year.