Samsung, Intel, Ericsson and IBM are jointly developing next-generation chips

Thanks to CTOnews.com netizens Wu Yanzu and OC_Formula for the clue delivery! CTOnews.com, February 1 (Xinhua)-- Samsung, Ericsson, IBM and Intel are jointly researching and developing next-generation chips. The National Science Foundation (NSF) is funding the partnership and has provided $50 million (currently about 338 million yuan) to the technology giants as part of their "Future of Semiconductors" program.

The National Science Foundation and the four technology giants will work together to develop next-generation chips in different fields on the basis of "joint design". CTOnews.com learned that Samsung, Ericsson, IBM and Intel will work together on device performance, chip and system levels, recyclability, environmental impact and manufacturability.

According to Sethuraman Panchanathan, director of NSF, "the future of semiconductors and microelectronics will require interdisciplinary research across materials, equipment and systems, as well as the participation of all-round talents from the academic and industrial sectors."

With a $50 million grant, the National Science Foundation aims to enable the partnership between Samsung, Ericsson, IBM and Intel to "inform research needs, stimulate innovation, accelerate the transformation of results into the market, and prepare for the future workforce."

This initiative is funded by the Future Semiconductor (FuSe) team of the National Science Foundation. Under the plan, progress in the development of new processes, materials, equipment and architectures has been hampered by independent development. The plan believes that through joint development, there are great opportunities to advance computing technology and reduce the cost of its application. The goal [.] is to cultivate a broad alliance of researchers from the scientific and engineering circles.

The foundation believes that a holistic, co-designed approach can accelerate the development of "high-performance, robust, secure, compact, energy-efficient and cost-effective solutions".