TSMC announces the opening of the industry's most successful use of 16nm FinFET technology to academics

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com February 3 news, TSMC website announced the launch of the university FinFET project, which aims to cultivate future semiconductor chip design talents and promote global academic innovation. In this project, teachers, students and academic researchers of the Open University use the process Design Kit (PDK) of the industry's most successful fin field effect transistor (FinFET) technology to upgrade their chip design learning experience to advanced 16nm FinFET technology. CTOnews.com learned that the project also provides university leading chip researchers with multi-project wafer (Multi-Project Wafer,MPW) services for 16nm (N16) and 7nm (N7) processes to accelerate the introduction of influential innovative research into practical applications.

TSMC works with service partners in Asia, Europe and North America to provide the following resources to support research projects for teaching and testing chips:

The TSMC N16 process-based instructional design kit, including educational design cases, training materials, and instructional films, leads students from the traditional planar transistor structure into the FinFET generation.

For influential research projects, including research and design for logic, analogy and RF, TSMC provides N16 and N7 process design kits to support test chips produced through MPW services.

As the most complete and dynamic design ecosystem in the industry, the Open Innovation platform (Open Innovation Platform) fully supports TSMC's technology and manufacturing. TSMC Design ecosystem Services partner is ready to establish contact with scholars involved in the university FinFET project to see the content of the project.