Shulou(Shulou.com)11/24 Report--

February 20 news, according to foreign media reports, after the fire of ChatGPT, an artificial intelligence chat robot trained by OpenAI, relevant manufacturers are introducing relevant technologies, Google is also speeding up the research and development and application of Bard, and some domestic manufacturers have announced that they are promoting the research and development and application of related technologies.

The large-scale application of artificial intelligence chat robots such as ChatGPT will not only enhance the application experience of introducing related technologies, but also bring new development opportunities for many fields, and memory chip is one of them.

According to media reports, Samsung Electronics, the world's largest memory chip manufacturer, is developing the next generation of customized memory chips for large-scale AI applications such as ChatGPT.

Affected by the decline in demand for consumer electronics, the global memory chip market has been not optimistic since the second half of last year, with both shipments and prices declining. The performance of Samsung Electronics and SK Hynix, the two major memory chip manufacturers, has also been affected. Revenue from Samsung's storage business fell sharply in the third and fourth quarters of last year compared with the same period last year, and the operating profit of its device solutions division fell even more sharply. The revenue and profit of SK Hynix also fell sharply in the second half of last year compared with the same period last year, and there was a net loss of 3.52 trillion won in the fourth quarter.

From the previous reports of foreign media, the fire of ChatGPT has indeed brought a new opportunity for the development of memory chips for Samsung Electronics and SK Hynix. Foreign media reported last week that orders for high-bandwidth memory (HBM) from Samsung Electronics and SK Hynix have increased significantly since the beginning of this year. At that time, foreign media also mentioned that compared with other DRAM, the performance of high-bandwidth memory vertically connected to multiple DRAM was significantly improved, but there was also a higher price, at least three times that of DRAM.

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