Changdian Technology: some production lines of integrated circuit and module packaging project start small batch verification production.

CTOnews.com March 7 news, Changdian Technology said on the investor interactive platform today that the company's 2021 non-public offering investment project is under construction, with an annual output of 10 billion pieces of high-density hybrid integrated circuits for communications and module packaging project some production lines began small batch verification production.

Changdian Technology pointed out that due to the repeated impact of the epidemic last year, the high inventory in the domestic communications consumer market and the downward pressure caused by the continuous adjustment of demand, the company comprehensively considered customer demand and market conditions, and slowed down the construction progress of the two projects from a prudent point of view.

CTOnews.com has reported that Changdian Technology announced last week that it will provide 4D millimeter wave radar advanced packaging production solutions to more customers to meet the increasingly diversified customized development and technical service needs of automotive electronics customers.

Data show that Changdian Technology is a chip manufacturing enterprise, focusing on the development of integrated circuit manufacturing and technical services, to provide customers with chip manufacturing one-stop service. CCTV previously demonstrated that the company has realized the packaging of mobile phone chips in the 4nm process.

Related readings:

"Changdian Technology provides 4D millimeter wave radar advanced package production solution to more customers: support L3 and above autopilot"