Huawei's "semiconductor packaging" patent is announced, which can reduce costs.

Thanks to CTOnews.com netizens for the delivery of clues on the way! CTOnews.com May 13 news, Huawei Technology Co., Ltd. applied for "semiconductor packaging" invention patent announced.

CTOnews.com attached Patent Summary:

A semiconductor package (100) includes a substrate (110), a semiconductor chip (111) having a top surface (103a) and a bottom (103b) opposite to the top surface, wherein the bottom surface (103b) of the semiconductor chip (111) is placed on the substrate (110), wherein the semiconductor chip (111) includes at least one first terminal pad (102a) for electrically connecting the semiconductor chip (111) on the top surface (103a) of the semiconductor chip (111). At least one all-metal body (113aPower113b) is placed on at least one first terminal pad (102ameme 102b) of the semiconductor chip (111), wherein at least one all-metal body (113aPower113b) has a spherical part (111adj111b) electrically connected to at least one first terminal pad (102ad02b); and a mold (115) enclosing the semiconductor chip (111) and the spherical part (111aj111b) of at least one all-metal body (113amem113b).

The patent provides an alternative mold embedding solution that reduces costs and provides efficient and reliable manufacturing of semiconductor packages.