Intel releases future chip packaging blueprint, which will be designed on glass substrate.

CTOnews.com May 19 news, according to Intel website news, Intel released a blueprint for advanced packaging technology. In the blueprint, Intel expects to turn traditional substrates into more advanced glass substrates.

Intel said that glass substrates can not only improve the strength of the substrate, but also further reduce power consumption and improve energy efficiency. CTOnews.com saw from Intel PPT that Intel developed a common packaging optical element technology to increase the bandwidth available for signal exchange through the design of glass substrates and optical transmission. Intel says the design also allows the chip to support hot-swappable mode.

In the IDM 2.0 development strategy previously proposed by Intel, wafer foundry business will become an important transformation project of Intel. In addition to manufacturing for fabless semiconductor enterprises such as Qualcomm, its packaging technology is also the object that Intel is trying to promote. Intel said that customers can choose TSMC, GF and other OEM, and then use Intel technology for packaging and testing. This model will bring customers more flexible way of manufacturing products.

Intel said that it has negotiated with the customers of the top 10 chip packaging factories in the world, and won the favor of Cisco and AWS in the domestic industry.