Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens for the delivery of the clues of rain and snow and kinja! CTOnews.com May 22 news, Huahai Qingke issued a notice that recently, the company's new generation of 12-inch ultra-precision wafer thinning machine Versatile-GP300 mass production machine sent to the leading integrated circuit enterprises.

▲ source: Huahaiqing Kehua Haiqingke said that the 12-inch ultra-precision wafer thinning machine is the first organic integrated equipment in the industry to achieve 12-inch wafer ultra-precision grinding and global planarization of CMP. Versatile-GP300 production machine can stably realize the total thickness change of 12-inch wafer grinding < 1um and the stability and control of the whole process of thinning process. The CMP multi-zone pressure intelligent control system breaks through the precision limit of the traditional thinning machine and realizes the stability and controllability of the whole process of thinning process.

Huahaiqingke is a semiconductor equipment manufacturer headquartered in Tianjin. CTOnews.com inquiry learned that the mass production of wafer processing equipment can meet the wafer thinning needs of integrated circuits, advanced packaging and other manufacturing processes. The equipment fills the gap in the field of ultra-precision thinning technology in the domestic chip equipment industry.

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