Shulou(Shulou.com)11/24 Report--

CTOnews.com June 4 news, according to Yahoo Finance report, TSMC has informed Hongsu, Xin Yun, Wanrun, Titanium and other back-end advanced packaging equipment manufacturers to greatly expand back-end production capacity.

▲ drawing source: TSMC

Reported that the current supply of GPU for AI training exceeds demand, mainly due to the lack of advanced packaging capacity of TSMC's CoWoS. TSMC has informed the supply chain that it will have significant CoWoS packaging capacity. According to reports, suppliers of back-end advanced packaging equipment for TSMC, such as Hongsu, Xin Yun, Wanrun and Titanium, have all received notification from TSMC to expand production.

In response, TSMC responded that it is still evaluating measures to expand advanced packaging capacity, including CoWoS, and will announce more detailed information at this month's legal conference.

CTOnews.com saw in the data that TSMC said at the global technology forum in May that the advanced packaging production line AP6c located in Zhunan would begin mass production within this year. In addition, TSMC will further expand the advanced packaging capacity of the AP6b production line.

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