TSMC, Samsung and Intel wrestle on the same stage, and the semiconductor industry starts a "super fine" competition.

CTOnews.com June 9, according to foreign science and technology media patentlyapple reports, the semiconductor industry is starting a "super fine" (Ultra-Fine) competition, TSMC, Samsung and Intel are wrestling on the stage.

TSMC, as the number one contract manufacturer in the world, has begun to develop 2nm technology to consolidate its position as a contract manufacturer and further widen the gap with its competitors.

TSMC has sent about 1000 R & D personnel to the Hsinchu Science Park to build "Fab 20" to trial-produce 2nm products for Apple and Nvidia.

CTOnews.com Note: TSMC recently announced the official opening of its sixth advanced packaging and testing plant, becoming the first integrated plant to integrate front-end to back-end process 3DFabric and testing services.

Samsung: Samsung Electronics announced in June 2022 that it would use the universal gate (GAA) process to mass produce 3nm chips, six months earlier than TSMC.

Kyung Kye-hyun, president of Samsung Electronics DS and president of Samsung DS, said in a speech at Daejeon KAIST in early May that starting with the 2nm process, we should catch up with TSMC's technological advantages.

Intel: Intel plans to improve foundry in the second half of 2024 to make chips with a range of 1.8 nanometers. In March, the company developed a plan to develop a next-generation mobile system-on-chip (SoC) using 1.8nm technology through a partnership with ARM.

Industry insiders are pessimistic that even if Intel succeeds in accordance with the road map, it will be a huge challenge for the company to achieve the ideal break-even rate.

Intel announced a new PowerVia technology at an event held on June 1, hoping to expand its influence in the contract manufacturing industry.