It is reported that the United States has begun to accept applications for $39 billion in semiconductor subsidies, and nearly 400 people are interested.

CTOnews.com June 23 news, according to Bloomberg News, the U.S."Chip Act" provides 39 billion U.S. dollars (CTOnews.com note: currently about 280.02 billion yuan) in subsidies for semiconductor manufacturing, and the Ministry of Commerce will begin accepting applications from semiconductor manufacturers.

U.S. Commerce Secretary Raymond Raimondo said the main goal of the subsidy program is to strengthen supply chain resilience and support the entire semiconductor ecosystem in the United States. The U.S. Department of Commerce will accept applications for subsidies from semiconductor manufacturers from now on.

▲ Source: Intel Ramondo stressed at the press conference that although the United States can build a fab at will, it is also inseparable from the support of the supply chain, chemicals, raw materials and various equipment required by the fab to make the fab operate smoothly.

▲ Source: Intel Bloomberg quoted people familiar with the matter as saying that manufacturing equipment and raw material suppliers with an investment of more than $300 million (currently about 2.154 billion yuan) can apply through the original procedures designed for semiconductor manufacturers. For smaller investors, the Commerce Department will introduce different subsidy application procedures in the coming months.

▲ Source: Intel CTOnews.com noted that Bloomberg said in its article that nearly 400 companies around the world have expressed interest in obtaining subsidies from the U.S. Department of Commerce, and these companies have semiconductor investment plans in 37 states.