Samsung predicts that NAND with more than 1000 layers will be available in 2030

CTOnews.com, June 30, according to South Korean media The Elec, Samsung storage executives recently attended the 2023 summer meeting of the Association of Electronic Engineers, saying that the V-NAND could be stacked to more than 1000 layers in 2030.

Samsung predicts that the competition for V-NAND will continue above 1000 tiers. Samsung launched 24 floors in 2013 and has grown to more than 200 in the past 10 years.

CTOnews.com Note: Samsung's original V-NAND has 128Gb (16GB) for each die capacity, and up to 24 layers of die stack can be achieved through 3D stacking technology, which means that the total capacity of 24 layers of stack will reach 384GB.

Photo Source: The Elec Samsung executives say that it is precisely because of the existence of V-NAND that it continues the history of NAND and is one of the few successful examples of technology and ecosystem creation in South Korea.

Samsung executives said that in order to promote 1000-story NAND technology, like building skyscrapers, many stability issues such as collapse, bending and fracture need to be considered, as well as challenges such as processing connecting holes, minimizing battery interference, shortening layer height and expanding storage capacity per layer.