Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens for the delivery of clues about the past. CTOnews.com August 22 news, Intel is actively engaged in advanced process research and development, but also to strengthen its advanced packaging business, is currently building the latest packaging plant in Penang, Malaysia, to strengthen the 2.5D / 3D packaging layout.

The company says it plans to quadruple its 3D Foveros packaging capacity by 2025. Robin Martin, vice president of Intel, revealed in an interview in Penang today that the new Penang plant will become the company's largest 3D advanced packaging stronghold in the future.

In 2021, Intel announced that it would invest $7.1 billion (CTOnews.com Note: currently about 51.759 billion yuan) to build a new leading semiconductor packaging plant operated by Intel in Baliubai, Penang.

According to Intel, as the physical interface between the processor and the motherboard, chip packaging plays a vital role in product-level performance. Advanced encapsulation technology facilitates the integration of various computing engines across multi-process technologies and helps to adopt a new approach in the system architecture.

According to reports, Intel's Foveros packaging technology uses 3D stack to realize the integration of logic to logic, which provides designers with great flexibility to mix and match technology IP blocks with various memory and input / output elements in the shape elements of new devices. The product can be divided into smaller chiplet or tile, where I / O, SRAM and power transmission circuits are manufactured in the base chip, and high-performance logic chips or blocks are stacked on top.

In addition, Intel's new packaging function is unlocking the new design by combining EMIB and Foveros technology to allow different small chips and blocks to interconnect, with performance basically equivalent to a single chip. With Foveros Omni, Intel says designers can gain more communication flexibility by using small chips or blocks in packaging.

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