It is reported that Nvidia is expanding the "non-TSMC supply chain", tripling the monthly production capacity of the "silicon intermediary layer" to 10,000 pieces.

CTOnews.com August 25 news, Nvidia has a close cooperation with TSMC. CTOnews.com has previously reported that, driven by Nvidia's increase in the number of AI chips, TSMC's advanced process capacity utilization has increased significantly recently, but Nvidia is now looking for more solutions provided by supply chain contract manufacturers to retain Nvidia's bargaining power for chip foundry and increase the production capacity of related components.

According to a report by the Taiwan media "Industrial and Commercial Times", Invida is building a non-TSMC CoWoS supply chain and is actively docking with UMC. Recently, UMC will expand its silicon intermediary layer (silicon interposer) production capacity, increasing its monthly production capacity from the current 3,000 to 10,000, and next year's production capacity is "expected to be on a par with TSMC", thus greatly alleviating the pressure that the CoWoS process is in short supply.

Taiwan media said that a few months ago, the rapid growth of demand for AI GPU led to a serious shortage of advanced packaging capacity of TSMC CoWoS. Equipment manufacturers estimate that TSMC will have a total production capacity of more than 120,000 CoWoS in 2023 and 240,000 in 2024, of which Nvidia will get 144000-150,000.

Colette Kress, Nvidia's chief financial officer, said recently that Nvidia's key manufacturing processes such as CoWoS packaging have been opened to other supply chain contract manufacturers, and Nvidia will continue to work with more suppliers to increase production capacity.