Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com August 28 news, Intel CEO Pat Kissinger (Pat Gelsinger) proposed to promote the IDM2.0 model in 2021, and decided to enter the wafer foundry industry to compete with TSMC, Samsung and so on.

In March 2021, Intel formed a new business unit for wafer foundry, Intel foundry Services (IFS), and now Intel looks set to innovate again.

Kwon Myung-sook, CEO of Intel Korea, told the Electronic News that Intel will carry out "open contract manufacturing" business in South Korea. She believes that "the 'open ecosystem' is the core axis of Intel's integrated semiconductor company IDM 2.0 vision."

According to reports, "Open OEM" aims to provide flexible OEM services so that Intel can encapsulate wafers produced by South Korean contract manufacturers such as Samsung Electronics or DB HiTek, or only use assembly or testing processes. In addition, Intel chips can be entrusted to South Korean contract manufacturers.

CTOnews.com found that Intel's current CEO, Pat Kissinger, developed the Intel IDM 2.0 strategy after returning to the company in 2021, with a focus on bringing Intel back into the contract manufacturing market.

"Intel does not have everything in semiconductor manufacturing, but IDM 2.0 maximizes synergies by dividing each other's areas of expertise," says Mr Kwon.

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