The world's first unmanned semiconductor packaging production line was unveiled, and Samsung announced successful automation

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com Sept. 4 news, unlike wafer manufacturing, semiconductor packaging process requires a lot of human resources. This is because the front-end process only needs to move the wafer, but the package needs to move multiple components, such as the substrate and the tray containing the product.

Before that, packaging and processing equipment basically required a lot of labor, but Samsung Electronics has fully automated devices such as wafer transfer devices (OHT), lifts and conveyor belts for moving goods up and down.

Kim Hee-yeol, General Manager of Samsung Electronics TSP (Test and system Packaging), announced at the 2023 New Generation Semiconductor Packaging equipment and material Innovation Strategy Forum that the company has successfully built the world's first unmanned semiconductor packaging factory.

According to reports, this automatic production line, located in Samsung Electronics Tian'an City and Wenyang City packaging plant, has been built since June 2023. This production line can reduce its manufacturing-related labor force by 85% and equipment failure rate by 90%. Efficiency is more than doubled.

Tu Yuan PexelsCTOnews.com found that unmanned production lines account for only about 20% of Samsung's current packaging production line, but Samsung has also set a goal of turning its packaging plant into full unmanned production by 2030.

"by minimizing shift work, engineers can now undertake more valuable work", which "will also help improve the health and quality of life of employees," Mr Jin said. "We will achieve a 'smart packaging factory'. Based on hardware and software automation, timely provide customers with high-quality, lowest-cost products.