Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com Sept. 6, ASML CEO Peter Wennink said in a recent interview with Reuters that despite some obstacles from suppliers, the company will still deliver High NA EUV machines by the end of the year as previously planned.

ASML said that a high numerical aperture EUV lithography (High-NA EUV) device, which is the size of a truck and sells for more than $300m each (CTOnews.com Note: about RMB 2.19 billion currently), can meet the needs of first-tier chipmakers and can make smaller and better chips in the next decade.

Wennink said some suppliers were unable to improve the quantity and quality of components, resulting in slight delays, but overall these difficulties were manageable and promised to deliver the first machine by the end of the year.

CTOnews.com previously reported that for the post-3nm era, ASML and its partners are developing a new EUV lithography machine, the Twinscan EXE:5000 series, which will have a 0.55 NA (high NA) lens with a resolution of up to 8nm, thus avoiding double or multiple exposures in 3nm and above nodes as much as possible.

Related readings:

"ASML shares the latest development of High-NA EUV lithography machine: target to enter the factory in 2024-2025"

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