Sources say Apple will use new materials to make thinner circuit boards to make valuable space for iPhone 16

CTOnews.com, Sept. 26 (Xinhua)-- Apple will start using a new material to make thinner printed circuit boards next year, according to blogger @ Mobile Chip.

It is reported that Apple will use resin coated copper foil (RCC) as the new printed circuit board (PCB) material in 2024, a change that will enable Apple to make thinner PCB, the current iPhone PCB is made of a flexible copper-based material. A thinner PCB can make valuable space inside compact devices such as iPhone and Apple Watch, providing more space for larger batteries or other components.

It was reported earlier that the screen size of the iPhone 16 Pro and Pro Max models is expected to increase from 6.1in and 6.7in to 6.3in and 6.9in, respectively. Part of the increase in size may be due to the need for more internal space to accommodate additional components, such as a four-prism telephoto camera with 5x optical zoom and capacitive Action buttons.

@ Mobile chipmaker first revealed that iPhone 14 will use A15 bionic chips, while A16 will belong exclusively to the iPhone 14 Pro model. CTOnews.com noted that recently the blogger also said that the A17 chip designed for iPhone 16 and iPhone 16 Plus will be manufactured in a completely different process than the A17 Pro in iPhone 15 Pro to reduce costs.