Armor announces the launch of the next generation of e-MMC embedded flash memory "conforming to version 5.1 specification"

Thanks to CTOnews.com netizens Wu Yanzu in South China for the delivery of clues! CTOnews.com September 27 news, according to the official press release, Kaixia announced today that it is in line with JEDEC e-MMC Ver. 5.1 standard "new high-performance embedded flash products" sample, mainly used for consumer applications.

According to a query from ▲ source Kaixia CTOnews.com, this new product will offer 64 and 128 GB samples and is said to be "integrated with the company's latest version of BiCS FLASH 3D flash memory and controller in a single package", thus reducing processor workload and improving ease of use.

It is reported that, compared with the previous generation of devices, the "continuous and random write" performance of the new sample is improved by about 2.5 times, and the random read performance is improved by about 2.7 times. In addition, compared with the previous generation of devices, TBW (Total Bytes Written, total number of bytes written) is about 3.3 times higher.

Kaixia believes that although the market is moving towards UFS, in some cases, some manufacturers may still use e-MMC, such as tablets, PCs, point-of-sale devices and other portable handheld devices, as well as "consumer products with mid-range storage needs" such as smart TVs and smart network cards.

Armor is currently testing this sample of e-MMC devices, and the related products are expected to be mass produced in the spring of 2024.