Not resistant to falling, Guo Mingyi said that Apple's iPhone motherboard would deploy RCC materials as soon as 2025.

Thanks to CTOnews.com netizens Wu Yanzu in South China for the delivery of clues! CTOnews.com, Oct. 13 (Xinhua)-- blogger @ Mobile Chip Talent revealed in September that Apple will use resin coated copper foil (RCC) as a new printed circuit board (PCB) material from next year to make a thinner PCB.

Guo Mingyi released a research note today, saying that Apple will not deploy the technology in 2024 because of its "fragile features" and "failure to pass the drop test," but he also said that Apple and its supplier Weisu could deploy to the iPhone 17 Pro if they can complete RCC material improvements by the third quarter of 2024.

CTOnews.com Note: the current iPhone PCB is made of a flexible copper-based material, and a thinner PCB can make valuable space inside compact devices such as iPhone and Apple Watch, providing more space for larger batteries or other components.

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