Samsung is exploring the next generation of semiconductor immersion heat dissipation

CTOnews.com October 26 news, Samsung Electronics recently attended the Pusan International Electronic Packaging Seminar (ISMP 2023), the company's DS department head Hwang Yu-cheol delivered a keynote speech, introduced the "immersion heat dissipation" solution.

CTOnews.com Note: Android phones will continue to ship 4nm process chips next year. Apple's iPhone 15 Pro series has adopted 3nm technology, and as semiconductor miniaturization reaches its physical limit, there is growing interest in packaging technology to improve chip performance.

How to control the heat of semiconductors has become a difficult problem for chip manufacturers and mobile phone manufacturers. The immersion heat dissipation proposed by Samsung can significantly reduce the heat dissipation power compared with the existing air heat dissipation.

Samsung admits that the initial input cost of the current solution is very high, it is highly stable and semi-permanent, so it has advantages in many ways.