Strengthen the layout, Hon Hai and United Power sprint the third generation semiconductors
CTOnews.com, September 17, according to Taiwan's Economic Daily, Hon Hai and United Power two major groups sprint for the third generation semiconductors. Liu Yangwei, chairman of Hon Hai, said that in recent years, Hon Hai has actively developed three major industries: electric vehicles, digital health and robotics, all of which need power and optoelectronic semiconductors to promote technological innovation.
Liu Yangwei stressed that Hon Hai was building and expanding its competitive advantage in third-generation semiconductors, including investing in silicon carbide substrate manufacturer Shengxin Materials, strengthening the upstream supply chain to ensure substrate supply, and rapidly expanding the product portfolio.
CTOnews.com learned that Hon Hai Semiconductor Research Institute said that with the development of 5G, electric vehicles, renewable green energy, aviation and other technologies, the importance of compound semiconductors has also increased, and Hon Hai will integrate the supply chain.
On the other hand, UMC has invested in Lianying Optoelectronics to cut into the third generation semiconductors, mainly providing 6-inch compound semiconductor wafer foundry services, covering gallium arsenide new generation HBT technology, 0.15um pHEMT technology, gallium nitride high power components to filters, and optoelectronic components manufacturing.
Lianying revealed that at present, Lianying is hot and full of production capacity, and the company plans to gradually convert a small part of the production capacity of niche silicon-based semiconductors into compound semiconductors and reduce the production capacity of silicon-based semiconductors, with the goal of turning to compound semiconductor manufacturing in two to three years. According to reports, Lianying accumulated rich experience in the 6-inch third-generation semiconductor market, followed by a comprehensive 8-inch layout.
