IC testing industry: SoC manufacturers are actively considering Wi-Fi 7 products, and are expected to introduce high-end mobile phones in the second half of 2024.

CTOnews.com September 20 news, according to Taiwan Electronic Times, IC test supply chain operators admitted that the current international WiFi SoC manufacturers are actively brewing Wi-Fi 7 products, the fastest expected in the second half of 2024 may support Wi-Fi 7 standard high-end mobile phones come out, but before that, router (Router) will take the lead in upgrading, followed by NB products.

In May, Qualcomm said Wi-Fi 7 chips had been shipped to customers, and terminal products were expected to be available by the end of the year and would be shipped in large quantities in 2023. Wi-Fi 7 penetration is expected to reach 10% between 2023 and 2024.

MediaTek also launched the first Wi-Fi 7 chips, using a 6nm process, providing a comprehensive platform that "combines Wi-Fi 7 with powerful AP and NPU to support maximum Wi-Fi, Ethernet and packet processing performance."

Intel has also demonstrated Wi-Fi 7 before, demonstrating speeds over 5Gbps across vendors, based on Core laptops + Broadcom Wi-Fi 7 access points.

Wi-Fi 7 can deliver higher speeds, lower latency, higher reliability, and greater capacity, including the use of 320MHz channel bandwidth in unlicensed 6GHz spectrum (speed doubling), 4K QAM quadrature amplitude modulation (20% speed improvement), multi-link operation MLO (improved throughput, link robustness, roaming, interference mitigation, and reduced latency), and improved channel utilization through multiple resource units (MRUs) and puncturing.

CTOnews.com has learned that the Wi-Fi 7 standard has not yet been finalized, and its product proposal is only a half-finished proposal based on the functions defined in the IEEE P802.11be draft amendment. Intel reportedly plans to launch Wi-Fi 7 certified products in accordance with the Wi-Fi Alliance certification timeline (2023-2024 time frame).