Shulou(Shulou.com)11/24 Report--

CTOnews.com Sept. 26, the latest news shows that Sony has completely changed the internal design of its PS5. According to previous news, the machine went on sale in some markets on September 15.

It turns out that the new version not only upgrades the internal structure, including a new motherboard and a smaller and lighter radiator, but also replaces newer chips for the mainframe.

According to Angstronomics, the third-generation PS5 host, code-named "CFI-1202", is equipped with a smaller SoC called "Oberon Plus".

The SoC is manufactured using TSMC's 6nm process and belongs to the same generation as the 7nm node that has been used in Sony's PS5 "Oberon" SoC.

Although the 6nm process is used, both have the same design and no changes have been made to the processor configuration, including API. That is, the underlying Zen2 CPU and RDNA2 GPU parts remain unchanged.

▲ Oberon Plus (left), Oberon (right), source: Angstronomics

CTOnews.com learned that the design and specifications of Oberon Plus are exactly the same as 7nm's Oberon, but the chip is smaller and consumes less power, which has been reduced to 260mm ²compared to the original 300mm ², so the new version of PS5 only needs a slightly less heat dissipation scheme.

For AMD and Sony, it also means they can make more chips from one wafer, so the cost of producing the new mainframe may be a little lower. If nothing happens, the same 7nm AMD SoC-based Xbox series will also be updated to 6nm design in the future.

"the internal structure of the new Sony PS5 is exposed: completely redesigned, lower energy consumption"

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