Shulou(Shulou.com)11/24 Report--

CTOnews.com, Oct. 26, according to TechPowerUp, Armor and Western Digital are celebrating the completion of the state-of-the-art semiconductor manufacturing plant Fab7 at the Yokkaichi factory in Japan today.

According to reports, the capacity of Fab7 will gradually increase with the passage of time. The total investment in the first phase of Fab7 is expected to be about 1 trillion yen (about 49.2 billion yuan). Part of the capital investment in the first phase of the Fab7 plant will be funded by government subsidies to promote cutting-edge semiconductor production facilities and ensure stable semiconductor production in Japan.

CTOnews.com has learned that Fab7 has the ability to produce the sixth generation of 162 layers of flash memory and future advanced 3D flash memory, and plans to start shipping 162 layers of flash memory in early 2023. The factory uses artificial intelligence to improve production efficiency and adopts a space-efficient design to expand the available space for manufacturing equipment in the clean room. Fab7 is built for safety and sustainability and can absorb earthquake shocks.

Nobuo Hayasaka, president and CEO of Armor, said: "Fab7 is the newest and most technologically advanced semiconductor manufacturing plant in Japan and is indispensable to the future of Armor."

Dr. Siva Sivaram, President of Western Digital Technology and Strategy, said, "with its innovative design and production efficiency, the new Fab7 plant demonstrates Western Digital's commitment to providing sustainable memory and storage technologies to customers around the world."

Armour and Western Digital have established a successful joint venture partnership for more than 20 years and will continue to maximize synergy through the joint development of 3D flash memory.

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