Asustek "Supernova SoM" chip package physical display: CPU and memory together

CTOnews.com, January 9 (Xinhua)-- Asustek and Intel have joined forces to launch a new chip package for laptops, called Supernova SoM (Supernova SoM), which combines the latest Intel CPU and LPDDR5X memory in the same package. Asustek demonstrated this technology at the CES show.

According to the source PC Watch, the Supernova SoM design combines Intel's 13th generation CPU chip and LPDDR5X memory together to form a complete package, reducing the PCB area from the original 50*60mm package to the current 42*44.7mm package. With the support of the packaging technology, CPU, memory particles and communication modules are highly integrated, which can reduce the core area of the motherboard by 38% and improve the overall heat dissipation efficiency of the system. In addition, compared with traditional packaging technology, supernova SoM shortens the distance between CPU and memory and can run memory at a higher frequency.

Asustek's latest Lingyao X Ultra notebook uses this "supernova SoM" packaging technology.

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