Bosch plans to acquire US chipmaker TSI Semiconductors

Thank you, Mr. Air, a netizen of CTOnews.com, for your clue delivery! CTOnews.com, April 28 (Xinhua), in order to further expand its semiconductor business, Bosch is planning to acquire American chipmaker TSI Semiconductors.

Headquartered in Roseville, California, TSI Semiconductors has 250 employees and is a contract manufacturer of application-specific integrated circuits (ASIC).

TSI currently develops and produces a large number of chips on 200mm silicon wafers for use in the mobile, telecommunications, energy and life sciences industries.

After the acquisition, Bosch plans to inject $1.5 billion into TSI (CTOnews.com Note: currently about 10.395 billion yuan) to transform its semiconductor manufacturing facilities into state-of-the-art processes. Bosch says 200mm wafers based on the innovative material silicon carbide (SiC) will produce the first chips in 2026.

Bosch is systematically strengthening its semiconductor business and will significantly expand its global SiC chip portfolio by the end of 2030. Bosch and TSI Semiconductor have reached an agreement not to disclose any financial details of the deal, which is subject to regulatory approval.