Shulou(Shulou.com)11/24 Report--

CTOnews.com, May 19 (Xinhua) as of this week, the U. S. Chip Program Office has received more than 300 applications from semiconductor manufacturers, according to Bloomberg.

According to the report, applications from semiconductor manufacturers increased by more than 100 in just one month.

The US Chip Planning Office pointed out that the applicants are distributed throughout the semiconductor industry chain, and CTOnews.com found that more than half of the applications came from the semiconductor manufacturing and back-stage packaging industries.

The Chip Program Office is responsible for receiving applications and assisting in the distribution of $52.7 billion (currently about 371.008 billion yuan) in semiconductor subsidy funds. Previously, it has made it clear that it will strictly review the qualifications of the applicants. Semiconductor manufacturers applying for subsidies must submit detailed financial data, planned objectives of the manufacturing program, and capital investment plans to prevent the grant from being misused.

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