SMIC IC test structure related patents announced

Thanks to CTOnews.com netizens for the delivery of clues on the way! CTOnews.com June 4 news, SMIC International Integrated Circuit Manufacturing (Shanghai) Co., Ltd., SMIC International Integrated Circuit Manufacturing (Beijing) Co., Ltd. applied for "integrated circuit test structure, its formation method and test method" patent announced.

The patent summary shows:

An integrated circuit test structure, a forming method and a test method thereof, wherein the integrated circuit test structure comprises a substrate and a first test structure located on the substrate. the first test structure includes a first test line and a first and a second liner group connected to both ends of the first test line, respectively. A second test structure located on a substrate, the second test structure includes a second test line and a third liner connected with the second test line, and the first test line is electrically isolated from the second test line. The first test line and the second test line form a capacitance structure. The integrated circuit test structure can use the same structure to test resistors and capacitors, thereby improving the accuracy of the correlation between the measured resistors and capacitors.

CTOnews.com obtained from the official, SMIC mainly provides 0.35micron to FinFET different technology nodes of wafer foundry and technical services. In the first quarter of 2023, the operating income was 10.209 billion yuan, down 13.9% from the same period last year, and the net profit from home was 1.591 billion yuan, down 44% from the same period last year.

At present, SMIC Shenzhen has entered mass production, SMIC Capital is expected to enter mass production in the second half of the year, SMIC Oriental is expected to open line by the end of the year, SMIC Xiqing is still under construction.