Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com, June 28 / PRNewswire-FirstCall-Asianet /-- Semiconductor equipment manufacturer Pan Lin recently announced the launch of Coronus DX, the world's first crystal edge deposition solution, designed to address key process challenges in next-generation logic chips, 3D NAND and advanced packaging applications.

▲ source: pan-Lin, the same as Pan-Lin pointed out that as semiconductor technology continues to shrink, chip manufacturing is becoming more and more difficult. Coronus DX can deposit a special protective film on the edge of the wafer, which helps to reduce the defects and damage that often occur in advanced semiconductor manufacturing and improve the yield of the chip.

Sesha Varadarajan, vice president of Pan Lin, said that Coronus DX helps to achieve predictable manufacturing and greatly improves yield. This technology can be used in advanced chip, semiconductor packaging and 3D NAND memory chip production, and reduce the cost of advanced process chip.

CTOnews.com access information learned that Pan-Lin's Coronus series is the industry's first mass production-proven crystal edge technology. Its Coronus and Coronus HP are designed to reduce defects by removing edge layers and are used to manufacture 3D chips. TSMC, Intel and Samsung Electronics are all important customers of the company.

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