Huawei publishes patents for flip chip packaging, which can improve the heat dissipation level of key components such as CPU and GPU.

Thanks CTOnews.com netizen three seasons also clue delivery! CTOnews.com August 16 news, Huawei Technologies Co., Ltd. recently published a patent entitled "Flip chip package with improved thermal performance," application publication number CN116601748A.

CTOnews.com learned from the official website of the State Intellectual Property Office that the patent embodiment "provides a flip-chip package, a device equipped with a circuit with an application package structure, and a method of assembling a package," with the aim of improving the heat dissipation performance of a series of patented application equipment.

▲ It is reported that the patent can be applied to CPU, GPU, FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit) and other chip types. The equipment can be smart phone, tablet computer, wearable mobile device, PC, workstation, server, etc.

▲ Source Huawei related patents

▲ According to Huawei's relevant patents, recent advances in processing performance of semiconductor packages have put forward higher requirements for thermal performance. Because the structural feature of "flip chip package" is that "the chip is connected to the substrate through bumps below it, so that the heat sink can be positioned on the top surface of the chip," the equipment can have more advantages in thermal performance.

To improve cooling performance, the patented device applies a thermal interface material (TIM) such as thermal grease to the top surface of the chip and sandwiches it between at least a portion of the chip and the heat sink, thereby reducing thermal resistance in the TIM, improving thermal performance of the package, and making the thermal interface material coating thinner.