Yacheng Micro released a new generation of envelope tracking chip, doubling the efficiency of power amplifier!
Recently, Yachengwei held a press conference on new high-efficiency power products and released a new generation of envelope tracking (ET) chips RM6100, RM61o2F1A1S, as well as two APT BUCK power chips and a BUCK BOOST power chip.
At present, in the world, envelope tracking technology (ET) is still at the forefront. The global companies that do envelope tracking (ET) power chip products include Qualcomm, Yacheng micro, MTK, Qorvo and so on. Yachengwei began to develop envelope tracking technology in 2014, and obtained the patent of "a power supply for envelope tracking" for the first time in 2018. By August 2023, it had obtained a total of 26 national invention patents and 4 international patents related to ET. Yachengwei ET products have been mass-produced and entered the commercial market, the key indicators are better than Qualcomm and other foreign manufacturers. Yacheng Micro's newly released RM61o2F1A1S is a commercial version customized for DJI UAV, which can support 100MHz signal broadband and has a maximum efficiency of more than 80%, which is higher than the related efficiency index of QET7100.
Yacheng micro ET product selection table
The APT BUCK power chip released at this meeting is mainly used in mobile phones and other wireless communication devices, while BUCK BOOST power chip is used in lightning wires, optical modules and battery power supply of equipment and other fields.
Yacheng Micro Product selection Table
In the 5G intelligent era, envelope tracking technology (ET) has attracted much attention because it can provide dynamic power for radio frequency power amplifier (PA), reduce power consumption and improve efficiency. It is believed that with the further construction of 5G network and the rapid popularization of 5G terminals, it will greatly drive the market demand of ET in the field of wireless communications such as smart phones, watches, drones and so on.
