Baiwei launched LPDDR5 + UFS3.1 integrated product uMCP, which can save 55% of the mobile phone motherboard space.

CTOnews.com October 11 news, domestic storage manufacturer Baiwei announced the launch of a series of uMCP products that integrate memory and flash memory into a module with a capacity of 8GB+256GB and a chip size of 11.5mm × 13.0mm × 1.0mm, which claims to save 55% of motherboard space compared with the separation of UFS3.1 and LPDDR5.

Baiwei uMCP chip can choose LPDDR5 + UFS3.1 and LPDDR4X + UFS2.2 versions, with the highest sequential reading and writing speed of 2100MB/s and 1800MB/s, and the highest frequency of 6400Mbps.

Baiwei said that compared with LPDDR4X-based uMCP products, LPDDR5-based uMCP products rely on self-developed firmware algorithms and firmware features such as Write booster, SLC Cache, HID, Deep Sleep and other firmware features to improve the reading speed to 2100MB/s. At the same time, Baiwei's uMCP products based on LPDDR5 support multi-Bank Group mode, adopt WCK signal design, etc., the data transmission rate is increased by 50% from 4266Mbps to 6400Mbps, and based on the dynamic voltage regulation (DVFS) function, the VDD2H of LPDDR5 is reduced from 1.1V to 1.05V from 0.6V to 0.5V, and the power consumption is reduced by 30%.

In addition, relying on packaging processes such as multi-stack Die and ultra-thin Die, Baiwei uMCP can save 55% of motherboard space by stacking LPDDR5 and UFS3.1 in one multi-chip stack, helping to simplify the circuit design of mobile phone motherboard and make room for improving battery capacity and layout of other parts of the motherboard.

CTOnews.com learned from Baiwei officials that uMCP products will also launch a high-capacity version of 12GB+512GB in the future.