IBM, Micron, Applied Materials and Tokyo Electronics announced a partnership to build a High-NA EUV R & D center.

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com, December 12, 2008. Earlier today, New York Governor Kathy Hochul (Kathy Hochul) announced a partnership with semiconductor giants such as IBM, Micron, Applied Materials, Tokyo Electronics (Tokyo Willy Cochon) and other semiconductor giants to invest $10 billion (CTOnews.com Note: currently about 71.8 billion yuan) to build the next generation High-NA EUV semiconductor R & D center in Albany NanoTech Complex, New York.

▲ source: according to the statement, IBM, the non-profit organization responsible for coordinating the construction of the facility, NY Creates will use $1 billion of state funds to purchase TWINSCAN EXE:5200 lithography machines from ASML.

New York state says that once the machine is installed, the project and its partners will start working on the next generation of chip manufacturing. The project will create 700 jobs and bring in at least $9 billion in private investment, according to an official statement.

In addition, officials stressed that this will be the first and only public R & D center in North America with a High-NA EUV lithography system, paving the way for the development and production of 2nm nodes and even more advanced chips.

▲ image source: IBM