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2024-11-04 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >
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Shulou(Shulou.com)12/24 Report--
CTOnews.com, December 16, according to a list published by the State intellectual property Office, Huawei obtained a patent for a new technology on December 12, which can improve wafer alignment efficiency and accuracy.
The patent is called "wafer processing device and wafer processing method" and is publicly known as CN117219552A. The application date is June 2022.
The patent summary attached to CTOnews.com is as follows:
The embodiments of the present disclosure relate to a wafer processing device and a wafer processing method.
The wafer processing device includes:
The wafer carrier can be rotated along the axis of rotation.
A mechanical arm, including a manipulator, for carrying and placing the wafer on the wafer carrier
The controller and the calibration assembly include a raster plate fixed relative to the wafer carrier
The light source is fixed relative to the raster plate, and the imaging element is fixed on the mechanical arm and is adapted to receive light emitted from the light source and passing through the raster plate.
The controller is configured to adjust the position of the wafer based on the detection of the received light by the imaging element and by controlling the adjustment device on the manipulator or the manipulator.
In the case that the wafer carrier carries the wafer, the grating plate and the imaging element are respectively located on both sides of the plane opposite to the upper surface of the wafer carrier, and the upper surface is used for carrying the wafer.
The apparatus and method provided by the disclosed embodiments can improve wafer alignment efficiency and alignment accuracy.
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