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The report says the NAND technology gap between China and South Korea has narrowed to 2 years.

2024-03-04 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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Shulou(Shulou.com)11/24 Report--

CTOnews.com, November 23, according to a report by South Korean media Business Korea, market insiders revealed that with Chinese mainland increasing its support for the memory industry, considerable progress has been made in the past few years, with the technology gap between NAND flash memory and Samsung, SK Hynix and other global leaders narrowed to two years.

The industry insiders pointed out: "although DRAM still maintains a technology gap of more than five years, due to the low technical barriers to NAND, Chinese enterprises are rapidly catching up with strong support and continue to narrow the gap. Although Chinese enterprises' NAND products are still insufficient in market competitiveness, they have obviously accelerated the speed of catch-up."

Changjiang Storage was specifically mentioned in the report. At the 2022 Flash Summit (FMS), the company officially unveiled the fourth generation of 3D TLC NAND flash memory chips based on Xtacking 3.0 architecture, called X3-9070.

After Changjiang Storage announced mass production from 176L to 232L, it was questioned by the outside world, but it took the company less than a year to mass produce the X3-9070.

In addition to being used in the TiPlus7100 series SSD, it is also used in Haicangwei's CC700 2TB SSD, which is the first 200 + layer 3D NAND flash solution to enter the retail market, ahead of Samsung, Micron, SK Hynix and other manufacturers.

The report also pointed out that with the miniaturization of semiconductor circuits approaching the limit, Chinese companies are seizing the opportunity of advanced packaging (Efficient packaging) to further narrow the technology gap.

In the semiconductor industry, advanced packaging mainly encapsulates multiple chips to improve performance, which is considered to be the key to overcome the challenge.

Chinese mainland has the second largest market share in semiconductor packaging. Changdian, Tonfu and Huatian entered the top 10 OSAT companies last year, while not a single South Korean company appeared on the list, citing data from market research firm IDC.

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