Network Security Internet Technology Development Database Servers Mobile Phone Android Software Apple Software Computer Software News IT Information

In addition to Weibo, there is also WeChat

Please pay attention

WeChat public account


TSMC first mentioned the 1.4nm process technology, and the 2nm process is scheduled to be produced in 2025.

2024-04-25 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >


Shulou( Report--

Thanks to netizens, assassins for their clues delivery! news on December 14, TSMC revealed at the panel seminar of IEEE International Electronic Devices Conference (IEDM) recently that its 1.4nm process research and development has been in full swing. At the same time, TSMC reiterated that the 2nm process will start mass production in 2025 as planned.

According to the slide given by SemiAnalysis's Dylan Patel by Pexels, the 1.4nm process node of TSMC is officially named A14. noted that TSMC has not disclosed the mass production time and specific parameters of the A14, but considering that the N2 node is scheduled for mass production by the end of 2025 and the N2P node is scheduled for mass production by the end of 2026, the A14 node is expected to be available in 2027-2028.

On the technical side, the A14 node is unlikely to use vertical stack complementary field effect transistor (CFET) technology, but TSMC is still exploring this technology. As a result, the A14 is likely to rely on TSMC's second-or third-generation surround-gate field-effect transistor (GAAFET) technology, like N2 nodes.

Nodes such as N2 and A14 will need system-level collaborative optimization to really play a role and achieve new performance, power consumption and functional levels.

It is unclear whether TSMC plans to adopt High-NA EUV lithography for the A14 process between 2027 and 2028, given that Intel (and possibly other chipmakers) will adopt and improve the next generation of EUV lithography machines with a numerical aperture of 0.55, which should be quite easy to use. However, because the high numerical aperture EUV lithography technology halves the mask size, its use will pose some additional challenges for chip designers and manufacturers.

Of course, a lot of things are likely to change between now and 2027-2028, so you can't make too many assumptions. But to be sure, TSMC scientists and developers are working on the research and development of the next generation of production nodes.

Welcome to subscribe "Shulou Technology Information " to get latest news, interesting things and hot topics in the IT industry, and controls the hottest and latest Internet news, technology news and IT industry trends.

Views: 0

*The comments in the above article only represent the author's personal views and do not represent the views and positions of this website. If you have more insights, please feel free to contribute and share.

Share To

IT Information


© 2024 SLNews company. All rights reserved.