According to CTOnews.com news on November 23, @ Redmi Red Rice phone warmed up the upcoming product, Xiaomi Redmi K70 Pro phone, via Weibo this afternoon.
This time, officials revealed the performance and heat dissipation performance of the new aircraft. According to reports, Redmi K70 Pro will be equipped with a new "ice cooling" system, including overall planning of heat dissipation system solutions, self-development of a new generation of heat dissipation materials. In addition, the machine is also equipped with AI temperature control full-range monitoring function, which claims to challenge the limit of passive heat dissipation and witness the "epoch-making" overall evolution of heat dissipation technology.
In addition, the first batch of Redmi K70 Pro is equipped with the third generation Snapdragon 8 mobile platform, and its AI performance can be improved by 98%, realizing the comprehensive evolution of CPU, GPU and AI performance. The official slogan is "pursue full performance".
According to previous reports from CTOnews.com, the blogger @ I Bing Universe revealed yesterday that Redmi K70 Pro will bid farewell to 8GB memory and start with 12GB. Compared with the Redmi K60 Pro model released last year, the price of the same memory starts at 3899 yuan, which also means that the starting price of the new machine may be adjusted. However, there is another possibility, that is, the new aircraft will not increase the price, maintaining the previous generation's price range, but everything will not be finally revealed until the press conference.
According to another blogger @ DSP-Charles, Redmi K70 Pro will bid farewell to plastic frames, metal frames and two other new configurations.
Earlier today, Xiaomi Guanxuan Redmi K70 series press conference is scheduled for November 29, when CTOnews.com will bring more detailed reports.
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