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Intel: glass substrate will be open to Intel OEM customers

2024-04-25 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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In September this year, Intel announced that it was the first to introduce glass substrates for the next generation of advanced packaging, and plans to provide complete solutions to the market in the next few years, thereby increasing the number of transistors in a single package and continuing to promote Moore's Law to meet the computing needs of data-centric applications.

Although the glass substrate is no stranger to the entire semiconductor industry, Intel has promoted it to a new level with its huge manufacturing scale and excellent technical personnel. Recently, Intel package and Test Technology Development (Assembly Test Technology Development) described why Intel invested in exploring glass substrates and how to make this technology a reality.

Computing demand drives Advanced Packaging Innovation

Advanced packaging is of great significance to the development of Moore's Law. The demand for processors with more powerful functions and performance has promoted the birth of multi-chip integration technology, upgrading packaging from a basic step in the complete design of processors to its key elements.

The breakthrough of advanced packaging technology is reflected in multi-chip processor products, this kind of processor integrates a series of chips, and its design idea is to make multiple chips work together.

In packaging, the main function of the substrate is to connect and protect many internal chips. The substrate can be compared to a "space converter". The nanoscale chip is connected to the substrate through micron pads (bond pads), and the substrate converts these pads into millimeter interconnections on the motherboard. In order to achieve this, the substrate needs to be flat and can handle input current and high-speed signals with high precision.

Relative advantage of glass substrate

Over the past 20 years, organic plastics have been the main materials used to build substrates, but with the increasing number of chips and wires in a single package, organic substrates are approaching the physical limit.

Therefore, the idea of replacing organic substrates with glass substrates is widely accepted in the semiconductor industry. Glass substrates are better and flatter in all respects (important for connecting flat silicon wafers to very flat motherboards), harder (better able to accommodate more and more smaller and smaller wires), and more stable.

In addition to better performance in basic functions, glass substrates are expected to increase interconnection density and optical interconnection integration by 10 times, so that future chips can process more data faster.

Dealing with the Technical Challenge of Glass substrate

Technological development is not easy, and there are always a lot of unknown difficulties, as is replacing organic substrates with glass substrates.

At the technical level, these challenges include figuring out what kind of glass is more efficient; how to layer metal and equipment to add microholes and wiring; and how to better dissipate heat and withstand mechanical forces throughout the life cycle of the product after installation.

In addition, there are many more practical problems: how to make the edges of the glass not easy to crack; how to split large glass substrates; and how to protect the glass substrates from bouncing off or flying off the conveyor belt or drum when transported in the factory.

In order to meet these extraordinary challenges and realize the glass substrate technology that can be used in the next generation of advanced packaging, a special team in Intel's packaging and testing technology development department has invested several years and carried out a great deal of debugging work. Many problems caused by the use of glass materials have been successfully solved, and the proper combination of groundbreaking technology and materials has been realized.

In the future, glass substrate technology will not only be used in Intel products, but will also be open to external customers through Intel contract Manufacturing Services (Intel Foundry Service). As the packaging and testing technology development department continues to improve the relevant technology portfolio, Intel is planning the first batch of internal and contract products using glass substrates.

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